Snapdragon 845 could be Qualcomm’s next high end chipset, made using 7nm process

Last month, we told you that Samsung and TSMC were chomping at the bit, each hoping to be designated a manufacturer of the next flagship Qualcomm chipset expected to be called the Snapdragon 845. Using the 7nm process, this SoC should be found inside next year’s high-end handsets with the Samsung Galaxy S9 getting first crack at employing it. Rumors have the chip rolling off the line early next year, which suggests that Samsung will return to its regular time frame next year and introduce its next flagship at MWC 2018. The annual conference will take place in 2018 starting on February 26th and running to March 1st.

Other chipsets to be produced with the 7nm process next year will be coming from Huawei’s Kirin, MediaTek, and Nvidia. Current high-end chips, like the Snapdragon 835, are produced using the 10nm process. Dropping down to 7nm will increase performance by 25% to 35% It also means a reduction in chip size, which could lead to a slight reduction in handset size for those models that use the Snapdragon 845.

Next week, Qualcomm is expected to unveil a new mid-to high-end chip called the Snapdragon 660. This SoC is expected to be found inside the new Samsung Galaxy C series, the Xiaomi Redmi Pro 2, Xiaomi Mi Max 2, Oppo R11, Vivo X9s Plus and the Nokia 7 and Nokia 8. It features four Cortex-A73 cores running at a clock speed of 2.3GHz, and four Cortex-A53 cores running at a clock speed of 1.9GHz. The graphics chip on board will be the Adreno 512 GPU, and the X10 LTE modem is included. Rapid recharging is offered with Quick Charge 4.0, and there is support for LPDDR4X 1866 MHz RAM and UFS 2.1 flash memory.

 

Source : PhoneArena